As Fired High Thermal Conductivity AlN Ceramic Substrate

Aluminum nitride (AlN) is an advanced ceramic material for high power hybrid semiconductor packaging where high thermal conductivity is required. AlN ceramic substrates have a thermal conductivity of more than 170W/m·K. Molding Technique of the Aluminum Nitride Ceramic Substrate Although dry pressing and isostatic pressing are suitable for producing high-performance aluminum nitride ceramic substrates, they are high in cost and low in production efficiency, and cannot meet the increasing demand for aluminum nitride ceramic substrates in the electronics industry.  In order to solve this problem, in recent years, many manufacturers have adopted tape casting technique to produce aluminum nitride ceramic substrates. Tape casting has also become the main molding technique for aluminum nitride ceramic substrates used in the electronics industry. Our Manufacturing Capacity The aluminum nitride ceramic substrate has high hardness and high bri…